TC74HC258AF-TP2EL
vs
HD74LS152P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
RENESAS TECHNOLOGY CORP
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP, DIP14,.3
Pin Count
16
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LS
JESD-30 Code
R-PDSO-G16
R-PDIP-T14
JESD-609 Code
e2
Length
10.3 mm
19.2 mm
Load Capacitance (CL)
50 pF
15 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
1
Number of Inputs
2
8
Number of Outputs
1
1
Number of Terminals
16
14
Operating Temperature-Max
85 °C
75 °C
Operating Temperature-Min
-40 °C
-20 °C
Output Characteristics
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
25 ns
21 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
5.06 mm
Supply Voltage-Max (Vsup)
6 V
5.25 V
Supply Voltage-Min (Vsup)
2 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL EXTENDED
Terminal Finish
TIN COPPER/TIN SILVER
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
7.62 mm
Base Number Matches
1
2
Max I(ol)
0.008 A
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
10 mA
Prop. Delay@Nom-Sup
32 ns
Compare TC74HC258AF-TP2EL with alternatives
Compare HD74LS152P with alternatives