HD74LS152P
vs
7603301FA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
LANSDALE SEMICONDUCTOR INC
Part Package Code
DIP
DFP
Package Description
DIP, DIP14,.3
DFP, FL16,.3
Pin Count
14
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDIP-T14
R-GDFP-F16
Length
19.2 mm
10.16 mm
Load Capacitance (CL)
15 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.008 A
0.004 A
Number of Functions
1
4
Number of Inputs
8
2
Number of Outputs
1
1
Number of Terminals
14
16
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-20 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Equivalence Code
DIP14,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Power Supply Current-Max (ICC)
10 mA
11 mA
Prop. Delay@Nom-Sup
32 ns
26 ns
Propagation Delay (tpd)
21 ns
26 ns
Qualification Status
Not Qualified
Qualified
Seated Height-Max
5.06 mm
2.03 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
6.73 mm
Base Number Matches
2
4
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Screening Level
MIL-STD-883
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Compare HD74LS152P with alternatives
Compare 7603301FA with alternatives