TC74HC258AF-TP1EL
vs
SN74LS151FN
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
LS
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J20
|
| Length |
10.3 mm
|
8.9662 mm
|
| Load Capacitance (CL) |
50 pF
|
15 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
INVERTED
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Propagation Delay (tpd) |
25 ns
|
30 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.9 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
5.3 mm
|
8.9662 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Package Equivalence Code |
|
LDCC20,.4SQ
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Power Supply Current-Max (ICC) |
|
10 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare TC74HC258AF-TP1EL with alternatives
Compare SN74LS151FN with alternatives