SN74LS151FN
vs
TC74HC258AF-TP2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TOSHIBA CORP
|
| Package Description |
QCCJ, LDCC20,.4SQ
|
SOP,
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
HC/UH
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDSO-G16
|
| Length |
8.9662 mm
|
10.3 mm
|
| Load Capacitance (CL) |
15 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
1
|
4
|
| Number of Inputs |
8
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Supply Current-Max (ICC) |
10 mA
|
|
| Propagation Delay (tpd) |
30 ns
|
25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
1.9 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
8.9662 mm
|
5.3 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
16
|
| JESD-609 Code |
|
e0
|
| Output Characteristics |
|
3-STATE
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare SN74LS151FN with alternatives
Compare TC74HC258AF-TP2 with alternatives