TC74HC138AP(F)
vs
MC74VHCT139AD
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TOSHIBA CORP
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
20 Weeks
|
|
| Samacsys Manufacturer |
Toshiba
|
|
| Family |
HC/UH
|
AHCT/VHCT
|
| Input Conditioning |
STANDARD
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| Length |
19.25 mm
|
9.9 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
OTHER DECODER/DRIVER
|
| Max I(ol) |
0.004 A
|
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
38 ns
|
|
| Propagation Delay (tpd) |
190 ns
|
16.5 ns
|
| Seated Height-Max |
4.45 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
1
|
4
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare TC74HC138AP(F) with alternatives
Compare MC74VHCT139AD with alternatives