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TC74HC138AP(F) vs 74HC4514PW,112 feature comparison

TC74HC138AP(F) Toshiba America Electronic Components

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74HC4514PW,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP TSSOP2
Package Description DIP, SOT-355, 24 PIN
Pin Count 16 24
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 20 Weeks
Samacsys Manufacturer Toshiba
Family HC/UH HC/UH
Input Conditioning STANDARD LATCHED
JESD-30 Code R-PDIP-T16 R-PDSO-G24
Length 19.25 mm 7.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER OTHER DECODER/DRIVER
Max I(ol) 0.004 A 0.004 A
Number of Functions 1 1
Number of Terminals 16 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP16,.3 TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 38 ns 69 ns
Propagation Delay (tpd) 190 ns 69 ns
Seated Height-Max 4.45 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 4.4 mm
Base Number Matches 1 2
Manufacturer Package Code SOT355-1
Additional Feature ADDRESS LATCHES
JESD-609 Code e4
Moisture Sensitivity Level 1
Qualification Status Not Qualified
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Logic » Decoder/Drivers
Logic » Decoder/Drivers

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Compare 74HC4514PW,112 with alternatives