TC7116ACPL
vs
TC7107CKW713
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
QFP
|
| Package Description |
DIP, DIP40,.6
|
QFP, QFP44,.52SQ,32
|
| Pin Count |
40
|
44
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
8 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Analog Input Voltage-Max |
3.35 V
|
3.35 V
|
| Analog Input Voltage-Min |
2.4 V
|
2.7 V
|
| Converter Type |
ADC, DUAL-SLOPE
|
ADC, DUAL-SLOPE
|
| JESD-30 Code |
R-PDIP-T40
|
S-PQFP-G44
|
| JESD-609 Code |
e3
|
e3
|
| Length |
51.97 mm
|
10 mm
|
| Number of Analog In Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
44
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QFP
|
| Package Equivalence Code |
DIP40,.6
|
QFP44,.52SQ,32
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
5.08 mm
|
2.45 mm
|
| Supply Current-Max |
1.8 mA
|
1.8 mA
|
| Supply Voltage-Nom |
9 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
10 mm
|
| Base Number Matches |
1
|
2
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare TC7116ACPL with alternatives
Compare TC7107CKW713 with alternatives