TC59LM818DMB-33
vs
K4C89183AF-ACFB0
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
TBGA,
TBGA,
Pin Count
60
60
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.5 ns
0.5 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e0
e0
Length
16.5 mm
15.5 mm
Memory Density
301989888 bit
301989888 bit
Memory IC Type
DDR DRAM
DDR1 DRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
16MX18
16MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
MOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
10.5 mm
Base Number Matches
1
1
Pbfree Code
Compare TC59LM818DMB-33 with alternatives
Compare K4C89183AF-ACFB0 with alternatives