TC58V64BFT
vs
HN62442BFA-10
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TOSHIBA CORP
RENESAS TECHNOLOGY CORP
Part Package Code
TSOP2
SOIC
Package Description
0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-44/40
SOP,
Pin Count
44
40
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDSO-G40
R-PDSO-G40
JESD-609 Code
e0
Length
18.41 mm
26 mm
Memory Density
67108864 bit
2097152 bit
Memory IC Type
EEPROM
MASK ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
8388608 words
131072 words
Number of Words Code
8000000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX8
128KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
PARALLEL
Peak Reflow Temperature (Cel)
240
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
3.05 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10.16 mm
10.7 mm
Base Number Matches
1
2
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
100 ns
Compare TC58V64BFT with alternatives
Compare HN62442BFA-10 with alternatives