TC5716200D-200 vs KM23V16000A-30 feature comparison

TC5716200D-200 Toshiba America Electronic Components

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KM23V16000A-30 Samsung Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description WDIP, DIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 200 ns 300 ns
Alternate Memory Width 8 8
JESD-30 Code R-GDIP-T42 R-PDIP-T42
JESD-609 Code e0 e0
Length 54.61 mm 52.43 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type UVPROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX16 1MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code WDIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.05 mm 5.08 mm
Supply Current-Max 0.06 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Package Equivalence Code DIP42,.6
Standby Current-Max 0.00005 A

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