TC55VL836FF-84 vs IDT71V67813S183PF feature comparison

TC55VL836FF-84 Toshiba America Electronic Components

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IDT71V67813S183PF Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description LQFP, QFP100,.63X.87 LQFP,
Pin Count 100 100
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 9 ns 3.3 ns
Clock Frequency-Max (fCLK) 83 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 262144 words 524288 words
Number of Words Code 256000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX36 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.6 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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