TC55VCM316BTGN45
vs
K6F8016V3M-TF700
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP1
TSOP2
Package Description
TSOP1, TSSOP48,.8,20
TSOP2,
Pin Count
48
44
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
70 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G48
R-PDSO-G44
Length
18.4 mm
18.41 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
44
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP2
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Voltage-Min
1.5 V
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
DUAL
Width
12 mm
10.16 mm
Base Number Matches
1
1
Rohs Code
Compare TC55VCM316BTGN45 with alternatives
Compare K6F8016V3M-TF700 with alternatives