TC55V1664BJI-10 vs HY62QF8100CSLF-I-70 feature comparison

TC55V1664BJI-10 Toshiba America Electronic Components

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HY62QF8100CSLF-I-70 SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP SK HYNIX INC
Part Package Code SOJ BGA
Package Description SOJ, SOJ44,.44 TFBGA,
Pin Count 44 48
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.B EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PDSO-J44 R-PBGA-B48
Length 28.58 mm 6.3 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 44 48
Number of Words 65536 words 131072 words
Number of Words Code 64000 128000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOJ TFBGA
Package Equivalence Code SOJ44,.44
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.7 mm 1.1 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 3 V
Supply Current-Max 0.24 mA
Supply Voltage-Max (Vsup) 3.6 V 2.7 V
Supply Voltage-Min (Vsup) 3 V 2.3 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND BALL
Terminal Pitch 1.27 mm 0.75 mm
Terminal Position DUAL BOTTOM
Width 10.16 mm 6.2 mm
Base Number Matches 1 1
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

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Compare HY62QF8100CSLF-I-70 with alternatives