TC551001CFI-85L vs EDI88130CS45CC feature comparison

TC551001CFI-85L Toshiba America Electronic Components

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EDI88130CS45CC Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP MICROSEMI CORP
Part Package Code SOIC DIP
Package Description 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
Samacsys Manufacturer Toshiba
Access Time-Max 85 ns 45 ns
JESD-30 Code R-PDSO-G32 R-CDIP-T32
JESD-609 Code e0
Length 20.6 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10.7 mm 10.16 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.41

Compare TC551001CFI-85L with alternatives

Compare EDI88130CS45CC with alternatives