TC4514BP
vs
MC74VHC259DTEL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
ON SEMICONDUCTOR
Part Package Code
DIP
TSSOP
Package Description
DIP,
TSSOP,
Pin Count
24
16
Reach Compliance Code
unknown
unknown
Additional Feature
ADDRESS LATCHES
ADDRESS LATCHES
Family
4000/14000/40000
AHC/VHC
Input Conditioning
LATCHED
STANDARD
JESD-30 Code
R-PDIP-T24
R-PDSO-G16
JESD-609 Code
e0
Length
32 mm
5 mm
Load Capacitance (CL)
50 pF
Logic IC Type
4-LINE TO 16-LINE DECODER
3-LINE TO 8-LINE DECODER
Number of Functions
1
1
Number of Terminals
24
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
970 ns
14.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.8 mm
1.2 mm
Supply Voltage-Max (Vsup)
18 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
4.4 mm
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.39.00.01
Compare TC4514BP with alternatives
Compare MC74VHC259DTEL with alternatives