TC4514BP
vs
HEF4514BDF
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
Additional Feature
ADDRESS LATCHES
Family
4000/14000/40000
4000/14000/40000
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
Length
32 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
4-LINE TO 16-LINE DECODER
4-LINE TO 16-LINE DECODER
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
970 ns
550 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.8 mm
5.84 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.39.00.01
Compare TC4514BP with alternatives
Compare HEF4514BDF with alternatives