TC4514BP vs HEF4514BDF feature comparison

TC4514BP Toshiba America Electronic Components

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HEF4514BDF NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 24 24
Reach Compliance Code unknown unknown
Additional Feature ADDRESS LATCHES
Family 4000/14000/40000 4000/14000/40000
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0
Length 32 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER 4-LINE TO 16-LINE DECODER
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 970 ns 550 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.8 mm 5.84 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8542.39.00.01

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