TC4467EOE vs MIC4467YWMTR feature comparison

TC4467EOE Telcom Semiconductor Inc

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MIC4467YWMTR Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TELCOM SEMICONDUCTOR INC MICREL INC
Package Description SOP, SOP16,.4 SOP,
Reach Compliance Code unknown compliant
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e3
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.4 SOP16,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code Yes
Part Package Code SOIC
Pin Count 16
ECCN Code EAR99
HTS Code 8542.39.00.01
High Side Driver NO
Interface IC Type NAND GATE BASED MOSFET DRIVER
Length 10.35 mm
Moisture Sensitivity Level 2
Number of Functions 4
Output Peak Current Limit-Nom 1.2 A
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.616 mm
Supply Voltage-Max 18 V
Supply Voltage-Min 4.5 V
Time@Peak Reflow Temperature-Max (s) 40
Turn-off Time 0.1 µs
Turn-on Time 0.1 µs
Width 7.49 mm

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