TC4422VSM713G
vs
TC4422MJA
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-609 Code |
e3
|
e1
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN SILVER COPPER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DIP
|
| Package Description |
|
DIP, DIP8,.3
|
| Pin Count |
|
8
|
| Factory Lead Time |
|
6 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| High Side Driver |
|
YES
|
| Input Characteristics |
|
SCHMITT TRIGGER
|
| JESD-30 Code |
|
R-GDIP-T8
|
| Length |
|
9.78 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
|
TOTEM-POLE
|
| Output Peak Current Limit-Nom |
|
9 A
|
| Output Polarity |
|
TRUE
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP8,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
TS 16949
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Current-Max |
|
3 mA
|
| Supply Voltage-Max |
|
18 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage1-Max |
|
18 V
|
| Supply Voltage1-Min |
|
4.5 V
|
| Surface Mount |
|
NO
|
| Temperature Grade |
|
MILITARY
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
| Turn-off Time |
|
0.2 µs
|
| Turn-on Time |
|
0.2 µs
|
| Width |
|
7.62 mm
|
|
|
|
Compare TC4422VSM713G with alternatives
Compare TC4422MJA with alternatives