TC4420EJAG
vs
5962-8877003PA
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
DEFENSE LOGISTICS AGENCY
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| High Side Driver |
NO
|
NO
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| Length |
9.78 mm
|
|
| Number of Functions |
1
|
1
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Peak Current Limit-Nom |
6 A
|
6 A
|
| Package Code |
DIP
|
DIP
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max |
18 V
|
18 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Pitch |
2.54 mm
|
|
| Turn-off Time |
0.1 µs
|
0.1 µs
|
| Turn-on Time |
0.1 µs
|
0.1 µs
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
6
|
| Package Description |
|
CERAMIC, DIP-8
|
| JESD-30 Code |
|
R-GDIP-T8
|
| JESD-609 Code |
|
e0
|
| Number of Terminals |
|
8
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Supply Voltage-Nom |
|
18 V
|
| Surface Mount |
|
NO
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare TC4420EJAG with alternatives