TC4050BFN vs HCF4050M013TR feature comparison

TC4050BFN Toshiba America Electronic Components

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HCF4050M013TR STMicroelectronics

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Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.25 SO-16
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature NOT AVAILABLE IN JAPAN HIGH TO LOW LEVEL TRANSLATOR
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.0038 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 130 ns 140 ns
Propagation Delay (tpd) 130 ns 140 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 20 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Samacsys Manufacturer STMicroelectronics
JESD-609 Code e4
Moisture Sensitivity Level 3
Packing Method TR
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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