TC3W02F(TE12L)
vs
SN74LVC1G29DCUR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TOSHIBA CORP
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
SOIC
Package Description
SOP,
GREEN, PLASTIC, VSSOP-8
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LVC/LCX/Z
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
5 mm
2.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OTHER DECODER/DRIVER
OTHER DECODER/DRIVER
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
VSSOP
Package Equivalence Code
SOP8,.19
TSSOP8,.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
165 ns
15.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
0.9 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1.65 V
Supply Voltage-Nom (Vsup)
4.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
3.1 mm
2 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Samacsys Manufacturer
Texas Instruments
JESD-609 Code
e3
Max I(ol)
0.032 A
Moisture Sensitivity Level
1
Number of Bits
1
Output Characteristics
3-STATE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
6.1 ns
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
Compare TC3W02F(TE12L) with alternatives
Compare SN74LVC1G29DCUR with alternatives