TC02G38R3BC vs RP73F1E38R3BTDG feature comparison

TC02G38R3BC Fenghua (HK) Electronics Ltd

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RP73F1E38R3BTDG TE Connectivity

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Yes
Yes Yes
Active Obsolete
FENGHUA ADVANCED TECHNOLOGY TE CONNECTIVITY LTD
CHIP, ROHS COMPLIANT CHIP
unknown unknown
EAR99
8533.21.00.30
Rectangular Chip
e3
SURFACE MOUNT SURFACE MOUNT
2 2
155 °C 155 °C
-55 °C -55 °C
0.3 mm 0.3 mm
1 mm 1 mm
RECTANGULAR PACKAGE RECTANGULAR PACKAGE
SMT SMT
0.5 mm 0.5 mm
BULK TR, PAPER, 7 INCH
0.0625 W 0.063 W
70 °C 70 °C
38.3 Ω 38.3 Ω
FIXED RESISTOR FIXED RESISTOR
0402 0402
YES YES
THIN FILM THIN FILM
25 ppm/°C 25 ppm/°C
Tin (Sn) - with Nickel (Ni) barrier
WRAPAROUND WRAPAROUND
0.1% 0.1%
25 V 25 V
1 1
HIGH PRECISION
RP73
MIL-STD-202
RP73

Compare TC02G38R3BC with alternatives

Compare RP73F1E38R3BTDG with alternatives