TC02G38R3BC
vs
RP73F1E38R3BTDG
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
FENGHUA ADVANCED TECHNOLOGY
TE CONNECTIVITY LTD
Package Description
CHIP, ROHS COMPLIANT
CHIP
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8533.21.00.30
Construction
Rectangular
Chip
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.3 mm
0.3 mm
Package Length
1 mm
1 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
0.5 mm
0.5 mm
Packing Method
BULK
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.0625 W
0.063 W
Rated Temperature
70 °C
70 °C
Resistance
38.3 Ω
38.3 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0402
0402
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.1%
0.1%
Working Voltage
25 V
25 V
Base Number Matches
1
1
Additional Feature
HIGH PRECISION
Manufacturer Series
RP73
Reference Standard
MIL-STD-202
Series
RP73
Compare TC02G38R3BC with alternatives
Compare RP73F1E38R3BTDG with alternatives