TBP24S10MJ vs M38510/20301BEX feature comparison

TBP24S10MJ Texas Instruments

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M38510/20301BEX Lansdale Semiconductor Inc

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC LANSDALE SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP,
Pin Count 16 16
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 75 ns 80 ns
JESD-30 Code R-GDIP-T16 R-XDIP-T16
Length 19.56 mm
Memory Density 1024 bit 16777216 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 16
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 256 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256X4 1MX16
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 4

Compare TBP24S10MJ with alternatives

Compare M38510/20301BEX with alternatives