TB2926CHQ
vs
TDF8551J
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
ZIP
|
SOT
|
| Package Description |
1 MM PITCH, PLASTIC, HZIP-25
|
PLASTIC, SOT725-1, SIL-37
|
| Pin Count |
25
|
37
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Toshiba
|
|
| Bandwidth-Nom |
20 kHz
|
22 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Harmonic Distortion |
10%
|
1%
|
| JESD-30 Code |
R-PZFM-T25
|
R-PZFM-T37
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
25
|
37
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
26 W
|
69 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
8 V
|
8 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
ZIG-ZAG
|
ZIG-ZAG
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
SOT725-1
|
|
|
|
Compare TB2926CHQ with alternatives
Compare TDF8551J with alternatives