TAS5614APHD
vs
TAS5614LADDV
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFP
|
SSOP
|
Package Description |
GREEN, PLASTIC, HTQFP-64
|
HSSOP-44
|
Pin Count |
64
|
44
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Harmonic Distortion |
0.03%
|
0.03%
|
JESD-30 Code |
S-PQFP-G64
|
R-PDSO-G44
|
JESD-609 Code |
e4
|
e4
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
3
|
Noise Figure-Nom |
103 dB
|
105 dB
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
44
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
|
Output Power-Nom |
150 W
|
150 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTQFP
|
HTSSOP
|
Package Equivalence Code |
TQFP64,.63SQ,32
|
TSSOP44,.33
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
13.2 V
|
13.2 V
|
Supply Voltage-Min (Vsup) |
10.8 V
|
10.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
14 mm
|
6.1 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare TAS5614APHD with alternatives
Compare TAS5614LADDV with alternatives