TAS2564YBGT
vs
MAX98502EWE+
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
VFBGA, BGA36,6X6,16
|
VFBGA, BGA16,4X4,20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Date Of Intro |
2019-12-21
|
|
Samacsys Manufacturer |
Texas Instruments
|
|
Bandwidth-Nom |
20 kHz
|
22 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
JESD-30 Code |
R-PBGA-B36
|
S-PBGA-B16
|
JESD-609 Code |
e1
|
e1
|
Length |
2.634 mm
|
2.045 mm
|
Moisture Sensitivity Level |
1
|
1
|
Noise Figure-Nom |
110 dB
|
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
36
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
7 W
|
4.1 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA36,6X6,16
|
BGA16,4X4,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.5 mm
|
0.69 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2.464 mm
|
2.045 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
16
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
2.7 mA
|
|
|
|
Compare TAS2564YBGT with alternatives
Compare MAX98502EWE+ with alternatives