TAS2563YBGT
vs
HPA00398DRBR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
VFBGA,
|
HVSON,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| JESD-30 Code |
R-PBGA-B42
|
S-PDSO-N8
|
| JESD-609 Code |
e1
|
e4
|
| Length |
2.997 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Noise Figure-Nom |
112.5 dB
|
105 dB
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
42
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
6.1 W
|
1.7 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.5 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.62 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2.538 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Supply Current-Max |
|
6 mA
|
| Technology |
|
CMOS
|
|
|
|
Compare TAS2563YBGT with alternatives
Compare HPA00398DRBR with alternatives