TA80960CA-25 vs A80960HT75 feature comparison

TA80960CA-25 Intel Corporation

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A80960HT75 Intel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code PGA PGA
Package Description CERAMIC, PGA-168 CERAMIC, PGA-168
Pin Count 168 168
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO YES
Clock Frequency-Max 50 MHz 25 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache NO YES
JESD-30 Code S-CPGA-P168 S-CPGA-P168
JESD-609 Code e0
Length 44.45 mm 44.7 mm
Low Power Mode NO NO
Number of DMA Channels 4
Number of External Interrupts 9 9
Number of Serial I/Os
Number of Terminals 168 168
On Chip Data RAM Width 8 8
Operating Temperature-Max 110 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Equivalence Code PGA168,17X17 PGA168,17X17
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
RAM (words) 512 1024
Seated Height-Max 4.57 mm 4.57 mm
Speed 25 MHz 75 MHz
Supply Current-Max 750 mA 1650 mA
Supply Voltage-Max 5.5 V 3.45 V
Supply Voltage-Min 4.5 V 3.15 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount NO NO
Technology CMOS MOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 44.45 mm 44.7 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Additional Feature OPERATING CASE TEMPERATURE 0 TO 90

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