TA80960CA-25
vs
A80486SLENHANCED1XCLKDX250
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
PGA
PGA
Package Description
CERAMIC, PGA-168
PGA,
Pin Count
168
168
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
YES
Clock Frequency-Max
50 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FLOATING POINT
Integrated Cache
NO
YES
JESD-30 Code
S-CPGA-P168
S-CPGA-P168
JESD-609 Code
e0
Length
44.45 mm
44.7 mm
Low Power Mode
NO
YES
Number of DMA Channels
4
Number of External Interrupts
9
4
Number of Serial I/Os
Number of Terminals
168
168
On Chip Data RAM Width
8
Operating Temperature-Max
110 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Equivalence Code
PGA168,17X17
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (words)
512
0
Seated Height-Max
4.57 mm
4.57 mm
Speed
25 MHz
50 MHz
Supply Current-Max
750 mA
950 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
44.45 mm
44.7 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
1
Additional Feature
DYNAMIC BUS SIZING; BURST BUS; MULTIPROCESSOR SUPPORT; ADVANCED POWER MANAGEMENT FEATURES
Compare TA80960CA-25 with alternatives
Compare A80486SLENHANCED1XCLKDX250 with alternatives