TA75902P
vs
MC33274AP
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
ON SEMICONDUCTOR
|
| Part Package Code |
DIP
|
PDIP-14
|
| Package Description |
DIP, DIP14,.3
|
PLASTIC, DIP-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
Toshiba
|
onsemi
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.15 µA
|
0.8 µA
|
| Bias Current-Max (IIB) @25C |
0.15 µA
|
0.65 µA
|
| Common-mode Reject Ratio-Nom |
85 dB
|
100 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
7000 µV
|
1800 µV
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.25 mm
|
18.86 mm
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
|
| Neg Supply Voltage Limit-Max |
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.45 mm
|
4.69 mm
|
| Supply Current-Max |
1.2 mA
|
12 mA
|
| Supply Voltage Limit-Max |
36 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Min |
20000
|
19950
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
5
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
646-06
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Slew Rate-Min |
|
8 V/us
|
| Slew Rate-Nom |
|
10 V/us
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
|
5500
|
|
|
|
Compare TA75902P with alternatives
Compare MC33274AP with alternatives