TA75902P vs LM324AN feature comparison

TA75902P Toshiba America Electronic Components

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LM324AN NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 0.300 INCH, PLASTIC, SOT-27-1, DIP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer Toshiba
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.15 µA 0.2 µA
Bias Current-Max (IIB) @25C 0.15 µA 0.1 µA
Common-mode Reject Ratio-Nom 85 dB 85 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 7000 µV 5000 µV
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0
Length 19.25 mm 19.025 mm
Low-Offset NO NO
Micropower YES YES
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 4.2 mm
Supply Current-Max 1.2 mA 3 mA
Supply Voltage Limit-Max 36 V 32 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Voltage Gain-Min 20000 25000
Width 7.62 mm 7.62 mm
Base Number Matches 1 15
Common-mode Reject Ratio-Min 65 dB
Peak Reflow Temperature (Cel) NOT SPECIFIED
Slew Rate-Nom 0.3 V/us
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 1000

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