T16M25F600B vs BT139F-600G feature comparison

T16M25F600B Diodes Incorporated

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BT139F-600G NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer DIODES INC NXP SEMICONDUCTORS
Package Description PLASTIC PACKAGE-3 FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code not_compliant unknown
Factory Lead Time 28 Weeks
Case Connection MAIN TERMINAL 2 ISOLATED
Configuration SINGLE SINGLE
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e3/e4
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RMS On-state Current-Max 16 A 16 A
Repetitive Peak Off-state Voltage 600 V 600 V
Surface Mount NO NO
Terminal Finish MATTE TIN/SILVER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Trigger Device Type 4 QUADRANT LOGIC LEVEL TRIAC TRIAC
Base Number Matches 2 1
Part Package Code SFM
Pin Count 3
ECCN Code EAR99
HTS Code 8541.30.00.80
Critical Rate of Rise of Commutation Voltage-Min 10 V/us
Critical Rate of Rise of Off-State Voltage-Min 200 V/us
DC Gate Trigger Current-Max 50 mA
DC Gate Trigger Voltage-Max 1.5 V
Holding Current-Max 60 mA
Repetitive Peak Off-state Leakage Current-Max 500 µA

Compare T16M25F600B with alternatives

Compare BT139F-600G with alternatives