SY89874AUMGTR vs CY2DP814ZXIT feature comparison

SY89874AUMGTR Microchip Technology Inc

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CY2DP814ZXIT Cypress Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code QFN TSSOP
Package Description HVQCCN, 4.40 MM, LEAD FREE, MO-153, PLASTIC TSSOP-16
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family 89874 2DP
Input Conditioning DIFFERENTIAL MUX DIFFERENTIAL
JESD-30 Code S-XQCC-N16 R-PDSO-G16
JESD-609 Code e4 e3
Length 3 mm 5 mm
Logic IC Type LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level 2 3
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 16 16
Number of True Outputs 4 4
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 0.7 ns 5 ns
Same Edge Skew-Max (tskwd) 0.015 ns 0.2 ns
Seated Height-Max 0.9 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.63 V 3.465 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Matte Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40 20
Width 3 mm 4.4 mm
fmax-Min 2500 MHz
Base Number Matches 2 1
Package Equivalence Code TSSOP16,.25
Prop. Delay@Nom-Sup 5 ns
Qualification Status Not Qualified
Technology CMOS

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