CY2DP814ZXIT
vs
CY2DP814Z
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
4.40 MM, LEAD FREE, MO-153, PLASTIC TSSOP-16
|
TSSOP, TSSOP16,.25
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
2DP
|
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
e0
|
Length |
5 mm
|
5 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
16
|
16
|
Number of True Outputs |
4
|
4
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP16,.25
|
TSSOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
5 ns
|
3.5 ns
|
Propagation Delay (tpd) |
5 ns
|
3.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.2 ns
|
0.2 ns
|
Seated Height-Max |
1.1 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
|
|
|
Compare CY2DP814ZXIT with alternatives
Compare CY2DP814Z with alternatives