SY89824LHCTR
vs
2308A-1HDCI
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFP
|
SOIC
|
Package Description |
HTFQFP, TQFP64,.47SQ
|
SOP, SOP16,.25
|
Pin Count |
64
|
16
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
89824
|
2308
|
Input Conditioning |
DIFFERENTIAL MUX
|
STANDARD
|
JESD-30 Code |
S-PQFP-G64
|
R-PDSO-G16
|
Length |
10 mm
|
9.9314 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
64
|
16
|
Number of True Outputs |
44
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
SOP
|
Package Equivalence Code |
TQFP64,.47SQ
|
SOP16,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Packing Method |
TR
|
|
Power Supply Current-Max (ICC) |
140 mA
|
|
Same Edge Skew-Max (tskwd) |
0.05 ns
|
0.2 ns
|
Seated Height-Max |
1.2 mm
|
1.7272 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
10 mm
|
3.937 mm
|
Base Number Matches |
1
|
4
|
JESD-609 Code |
|
e0
|
Max I(ol) |
|
0.012 A
|
Moisture Sensitivity Level |
|
1
|
Output Characteristics |
|
3-STATE
|
Peak Reflow Temperature (Cel) |
|
240
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
fmax-Min |
|
133.3 MHz
|
|
|
|
Compare SY89824LHCTR with alternatives
Compare 2308A-1HDCI with alternatives