SY89824LHC
vs
2309A-1HDCI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
SOIC
Package Description
TQFP-64
SOP, SOP16,.25
Pin Count
64
16
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
89824
2309
Input Conditioning
DIFFERENTIAL MUX
STANDARD
JESD-30 Code
S-PQFP-G64
R-PDSO-G16
Length
10 mm
9.9314 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
PLL BASED CLOCK DRIVER
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
64
16
Number of True Outputs
44
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HTFQFP
SOP
Package Equivalence Code
TQFP64,.47SQ
SOP16,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
SMALL OUTLINE
Power Supply Current-Max (ICC)
140 mA
Same Edge Skew-Max (tskwd)
0.05 ns
0.7 ns
Seated Height-Max
1.2 mm
1.7272 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
10 mm
3.937 mm
Base Number Matches
2
1
JESD-609 Code
e0
Max I(ol)
0.012 A
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
8.7 ns
Propagation Delay (tpd)
8.7 ns
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
fmax-Min
133 MHz
Compare SY89824LHC with alternatives
Compare 2309A-1HDCI with alternatives