SY88973BLMGTR
vs
SY88353BLMG-TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
3 X 3 MM, LEAD FREE, MLF-16
3 X 3 MM, LEAD FREE, MLF-16
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQCC-N16
S-XQCC-N16
JESD-609 Code
e4
e4
Length
3 mm
3 mm
Moisture Sensitivity Level
1
2
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.9 mm
0.95 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
3 mm
3 mm
Base Number Matches
1
2
ECCN Code
EAR99
Samacsys Manufacturer
Microchip
Applications
SDH; SONET
Package Equivalence Code
LCC16,.12SQ,20
Peak Reflow Temperature (Cel)
260
Supply Current-Max
62 mA
Time@Peak Reflow Temperature-Max (s)
40
Compare SY88973BLMGTR with alternatives
Compare SY88353BLMG-TR with alternatives