SY88303BLMG-TR
vs
SY88973BLMGTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICREL INC
MICROCHIP TECHNOLOGY INC
Package Description
LEAD FREE, MLF-16
3 X 3 MM, LEAD FREE, MLF-16
Reach Compliance Code
compliant
compliant
JESD-30 Code
S-XQCC-N16
S-PQCC-N16
JESD-609 Code
e4
e4
Length
3 mm
3 mm
Moisture Sensitivity Level
2
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.95 mm
0.9 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
ATM/SONET/SDH SUPPORT CIRCUIT
ATM/SONET/SDH SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
3 mm
3 mm
Base Number Matches
2
1
HTS Code
8542.39.00.01
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