SY10H602JZ
vs
MC10H602FNR2
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MOTOROLA INC
|
| Part Package Code |
QLCC
|
|
| Package Description |
LCC-28
|
QCCJ,
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
TTL TO ECL TRANSLATOR
|
TTL TO ECL TRANSLATOR
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| Length |
11.48 mm
|
11.5062 mm
|
| Number of Bits |
1
|
9
|
| Number of Functions |
9
|
1
|
| Number of Terminals |
28
|
28
|
| Output Latch or Register |
LATCH
|
LATCH
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
11.48 mm
|
11.5062 mm
|
| Base Number Matches |
2
|
3
|
| Delay-Max |
|
|
| Input Characteristics |
|
STANDARD
|
| Operating Temperature-Max |
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
|
OPEN-EMITTER
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
50 mA
|
| Supply Voltage1-Max |
|
-5.46 V
|
| Supply Voltage1-Min |
|
-4.94 V
|
| Supply Voltage1-Nom |
|
-5.2 V
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
COMMERCIAL EXTENDED
|
|
|
|
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