SY100EPT22VKG-TR
vs
MC100EPT22DR2
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ONSEMI
|
Package Description |
LEAD FREE, MSOP-8
|
SOIC-8
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
Microchip
|
|
Additional Feature |
CAN ALSO OPERATE WITH 5V SUPPLY
|
|
Delay-Max |
0.6 ns
|
0.7 ns
|
Interface IC Type |
TTL/CMOS TO PECL TRANSLATOR
|
TTL/CMOS TO PECL TRANSLATOR
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e0
|
Length |
3 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Latch or Register |
NONE
|
NONE
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Equivalence Code |
TSSOP8,.19
|
SOP8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
235
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.75 mm
|
Supply Current-Max |
25 mA
|
|
Supply Voltage-Max |
3.465 V
|
3.6 V
|
Supply Voltage-Min |
3.135 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
3 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
Technology |
|
ECL
|
|
|
|
Compare SY100EPT22VKG-TR with alternatives
Compare MC100EPT22DR2 with alternatives