SY100EP195VTITR vs SY100EP196VTC feature comparison

SY100EP195VTITR Microchip Technology Inc

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SY100EP196VTC Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICREL INC MICROCHIP TECHNOLOGY INC
Part Package Code QFP
Package Description TQFP, TQFP32,.35SQ,32 TQFP-32
Pin Count 32
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V
Family 100E 100E
JESD-30 Code S-PQFP-G32 S-PQFP-G32
JESD-609 Code e0 e0
Length 7 mm 7 mm
Logic IC Type ACTIVE DELAY LINE ACTIVE DELAY LINE
Moisture Sensitivity Level 2 2
Number of Functions 1 1
Number of Taps/Steps 1023 1023
Number of Terminals 32 32
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP TQFP
Package Equivalence Code TQFP32,.35SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE FLATPACK, THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 240
Power Supply Current-Max (ICC) 180 mA
Programmable Delay Line YES YES
Prop. Delay@Nom-Sup 15.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology ECL ECL
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Total Delay-Nom (td) 12.2 ns 12.2 ns
Width 7 mm 7 mm
Base Number Matches 2 1

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