SY100EP16VSKYTR
vs
MC100LVEL16DR2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICREL INC
|
MOTOROLA INC
|
| Part Package Code |
MSOP
|
SOIC
|
| Package Description |
HTSSOP,
|
SOP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
CAN ALSO OPERATE WITH A 5V SUPPLY
|
|
| Differential Output |
NO
|
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
0.25 ns
|
0.4 ns
|
| Receiver Number of Bits |
1
|
1
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Supply Voltage-Max |
3.63 V
|
|
| Supply Voltage-Min |
2.97 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
2
|
3
|
| Technology |
|
ECL
|
|
|
|
Compare SY100EP16VSKYTR with alternatives
Compare MC100LVEL16DR2 with alternatives