SX5809
vs
JANTXV1N5809CB
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
MICROSEMI CORP
|
| Package Description |
E-LALF-W2
|
HERMETIC SEALED, GLASS, E, 2 PIN
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
CASE 304
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
METALLURGICALLY BONDED
|
HIGH RELIABILITY
|
| Application |
EFFICIENCY
|
ULTRA FAST RECOVERY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
E-LALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Non-rep Pk Forward Current-Max |
125 A
|
125 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
3 A
|
3 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ELLIPTICAL
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Recovery Time-Max |
0.03 µs
|
0.03 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
1
|
1
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
MIL-19500/742
|
|
|
|
Compare SX5809 with alternatives
Compare JANTXV1N5809CB with alternatives