STP2003QFP
vs
STP2003PQFP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SUN MICROSYSTEMS INC
|
SUN MICROSYSTEMS INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
HEAT SPREADER, PLASTIC, QFP-208
|
FQFP, QFP208,1.2SQ,20
|
| Pin Count |
208
|
208
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
40 MHz
|
33.3 MHz
|
| Communication Protocol |
MIL STD 1553A; MIL STD 1553B; STANAG 3838
|
MIL STD 1553
|
| Data Encoding/Decoding Method |
NRZ
|
|
| Data Transfer Rate-Max |
12.5 MBps
|
12.5 MBps
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
| Length |
28 mm
|
28 mm
|
| Number of Serial I/Os |
4
|
4
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
4.1 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
28 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
| Base Number Matches |
1
|
1
|
| Bus Compatibility |
|
PCI
|
| Low Power Mode |
|
YES
|
|
|
|