STM32L152RBH6TTR
vs
STM32L152RBH6TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Clock Frequency-Max
24 MHz
32 MHz
DMA Channels
YES
YES
External Data Bus Width
Length
5 mm
5 mm
Number of I/O Lines
51
51
Number of Terminals
64
64
PWM Channels
YES
YES
Package Code
TFBGA
TFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Speed
32 MHz
32 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.8 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Width
5 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
BGA
Package Description
TFBGA, BGA64,8X8,20
Pin Count
64
ECCN Code
3A991.A.2
Boundary Scan
YES
CPU Family
CORTEX-M3
DAC Channels
YES
JESD-30 Code
S-PBGA-B64
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA64,8X8,20
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
RAM (bytes)
16384
ROM (words)
131072
ROM Programmability
FLASH
Seated Height-Max
1.2 mm
Temperature Grade
INDUSTRIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare STM32L152RBH6TTR with alternatives
Compare STM32L152RBH6TR with alternatives