STM32F103RBH6XXXTR
vs
STM32F103RBH6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
CPU Family
CORTEX-M3
CORTEX-M3
Clock Frequency-Max
8 MHz
16 MHz
DAC Channels
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B64
S-PBGA-B64
Length
8 mm
5 mm
Number of DMA Channels
7
Number of I/O Lines
51
51
Number of Terminals
64
64
Number of Timers
7
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA64,8X8,20
BGA64,8X8,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
20480
20480
ROM (words)
131072
131072
ROM Programmability
FLASH
FLASH
Speed
72 MHz
72 MHz
Supply Current-Max
50 mA
50 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.7 V
2 V
Supply Voltage-Nom
2.7 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
ECCN Code
3A991.A.2
Samacsys Manufacturer
STMicroelectronics
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
40
Compare STM32F103RBH6XXXTR with alternatives
Compare STM32F103RBH6 with alternatives