STM32F103RBH6TR
vs
STM32F103RBH6XXXTR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
Package Description
TFBGA, BGA64,8X8,20
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
STMicroelectronics
Has ADC
YES
YES
Address Bus Width
32
Bit Size
32
32
CPU Family
CORTEX-M3
CORTEX-M3
Clock Frequency-Max
72 MHz
8 MHz
DAC Channels
YES
NO
DMA Channels
YES
YES
External Data Bus Width
32
JESD-30 Code
S-PBGA-B64
S-PBGA-B64
JESD-609 Code
e1
Length
5 mm
8 mm
Moisture Sensitivity Level
3
Number of I/O Lines
51
51
Number of Terminals
64
64
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA64,8X8,20
BGA64,8X8,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
20480
20480
ROM (words)
131072
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
Speed
1.25 MHz
72 MHz
Supply Current-Max
50 mA
50 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
2.7 V
Supply Voltage-Nom
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5 mm
8 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Rohs Code
Number of DMA Channels
7
Number of Timers
7
Compare STM32F103RBH6TR with alternatives
Compare STM32F103RBH6XXXTR with alternatives