STM32F100R8T7BTR
vs
STM32F100R6H6BXXX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
QFP
BGA
Package Description
LFQFP, QFP64,.47SQ,20
TFBGA, BGA64,8X8,20
Pin Count
64
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
STMicroelectronics
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
NO
NO
CPU Family
CORTEX-M3
CORTEX-M3
Clock Frequency-Max
24 MHz
24 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PQFP-G64
S-PBGA-B64
Length
10 mm
5 mm
Number of I/O Lines
50
50
Number of Terminals
64
64
On Chip Program ROM Width
8
8
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
TFBGA
Package Equivalence Code
QFP64,.47SQ,20
BGA64,8X8,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
8192
4096
ROM (words)
65536
32768
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.2 mm
Speed
24 MHz
24 MHz
Supply Current-Max
15.7 mA
15.7 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
10 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Pbfree Code
Rohs Code
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