STM32F100R8H6BTR
vs
STM32F100R8H7BTR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA64,8X8,20
TFBGA, BGA64,8X8,20
Pin Count
64
64
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
NO
NO
CPU Family
CORTEX-M3
CORTEX-M3
Clock Frequency-Max
24 MHz
24 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B64
S-PBGA-B64
Length
5 mm
5 mm
Number of I/O Lines
50
50
Number of Terminals
64
64
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA64,8X8,20
BGA64,8X8,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
8192
8192
ROM (words)
65536
65536
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
1.2 mm
Speed
24 MHz
24 MHz
Supply Current-Max
15.7 mA
15.7 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
5 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Compare STM32F100R8H6BTR with alternatives
Compare STM32F100R8H7BTR with alternatives