STK20C04-W25 vs U630H04BSC25 feature comparison

STK20C04-W25 Cypress Semiconductor

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U630H04BSC25 ZMDI

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIMTEK CORP ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code DIP SOIC
Package Description DIP, DIP28,.6 SOP, SOP28,.4
Pin Count 28 24
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
JESD-30 Code R-PDIP-T28 R-PDSO-G24
JESD-609 Code e0 e0
Length 36.83 mm 15.4 mm
Memory Density 4096 bit 4096 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 24
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512X8 512X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP28,.6 SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 2.65 mm
Standby Current-Max 0.00075 A 0.001 A
Supply Current-Max 0.085 mA 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.5 mm
Base Number Matches 2 2
Pbfree Code No
Moisture Sensitivity Level 3

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Compare U630H04BSC25 with alternatives